Semiconductors
Chip industry solutionsChip packaging is a key link to ensure the long-term reliability of semiconductor devices. Its sealing performance directly affects the working stability and service life of the chip in complex environments.As chip feature sizes continue to shrink and packaging density continues to increase, the requirements for packaging airtightness are becoming increasingly stringent.Hairis provides professional sealing testing solutions for the special needs of chip packaging processes to ensure that chip products maintain excellent performance throughout their life cycles.
We provide precise testing for four key aspects of chip packaging:
Wafer level package seal inspection
High-precision partial vacuum detection technology is used to evaluate wafer bonding quality, accurately identify micron-level sealing defects, and ensure bonding interface integrity.
Device-level hermetic packaging verification
Helium mass spectrometry leak detection is performed on metal/ceramic packaged devices with a detection accuracy of 10⁻¹² mb·L/s, meeting the requirements of high-reliability applications such as aerospace and military industry.
Evaluation of moisture-proof performance of plastic-encapsulated devices
Through accelerated environmental testing and permeability testing, the interface sealing performance of the plastic packaging material and the lead frame is evaluated, and the service life of the product is predicted.
3D packaging structure sealing inspection
For advanced packaging structures such as TSV and through silicon vias, special testing solutions are provided to ensure the sealing reliability of multi-layer stack structures.
Detection accuracy increased to 10⁻¹² mb·L/s, leading the industry standard
Packaging yield increased to over 99.95%
The detection efficiency is increased by 6 times, and the detection time of a single chip is ≤3 seconds.
The on-site failure rate of customer products is reduced to less than 50ppm
